350 nanometer

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CMOS manufacturing
processes

10 µm
3 µm
1.5 µm
1 µm
800 nm (0.80 µm)
600 nm (0.60 µm)
350 nm (0.35 µm)
250 nm (0.25 µm)
180 nm (0.18 µm)
130 nm (0.13 µm)
90 nm
65 nm
45 nm
32 nm (Double Patterning)
22 nm (End of Planar Bulk CMOS)
16 nm (Transition to Nanoelectronics)
11 nm (Nanoelectronics)

The 350 nanometer (350 nm or 0.35 µm) process refers to the level of semiconductor process technology that was reached in the 1995-1996 timeframe, by most leading semiconductor companies, like Intel and IBM.

[edit] Products featuring 350 nm manufacturing process

Intel Pentium Pro (1995), Pentium (P54CS, 1995), and initial Pentium II CPUs (Klamath, 1997).
AMD K5 (1996) and original AMD K6 (Model 6, 1997) CPUs.
NEC VR4300, used in the Nintendo 64 game console.

Preceded by 600 nm	CMOS manufacturing processes	Succeeded by 250 nm

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